Citation link: http://dx.doi.org/10.25819/ubsi/9954
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Dokument Type: Doctoral Thesis
metadata.dc.title: Transmitter and channel design for multi-chip communication interfaces
Other Titles: Sender und Kanaldesign für Multi-Chip-Kommunikationsschnittstellen
Authors: Chaudhary, Muhammad Waqas 
Institute: Department Elektrotechnik - Informatik 
Free keywords: Multi-Chip-Module, Chip-to-Chip, Communication Interfaces, Transmitter, 2.5D Interposer, Multi-Chip-Modul, Sender, Kanal, Co-Design, 2.5D-Silizium-Interposer
Dewey Decimal Classification: 621.3 Elektrotechnik, Elektronik
GHBS-Clases: YEY
XVWD
Issue Date: 2020
Publish Date: 2021
Abstract: 
The size of integrated circuit (IC) die has continuously increased due to Moore’s law
in the last few decades. A large system on chip (SOC) contains many complex analog
and digital blocks which must run at high clock rate to support the needs of today’s
applications. These large SOCs suffer from global interconnect delay bottleneck and
increased design complexity. In order to deal with...

Die Größe der integrierten Schaltkreise (ICs) hat aufgrund des Mooreschen Gesetzes
in den letzten Jahrzehnten kontinuierlich zugenommen. Dabei enthalten große System
on Chip (SOC) Lösungen viele komplexe analoge und digitale Blöcke, die mit
hoher Taktrate laufen müssen, um die Anforderungen der heutigen Anwendungen zu
unterstützen. Die mitunter größten Herausforderungen derartiger SOCs...
DOI: http://dx.doi.org/10.25819/ubsi/9954
URN: urn:nbn:de:hbz:467-19412
URI: https://dspace.ub.uni-siegen.de/handle/ubsi/1941
License: Creative Commons BY-NC 4.0    Creative Commons BY-NC 4.0
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